|
7.
Product and Process Comparisons
7.2. Comparisons based on data from one process
|
|||
| Testing proportion defective is based on the binomial distribution |
The proportion of defective items in a manufacturing process
can be monitored using statistics based on the observed number of
defectives in a random sample of size N from a continuous
manufacturing process, or from a large population or lot. The
proportion defective in a sample follows the
binomial distribution
where p
is the probability of an individual item being found defective.
Questions of interest for quality control are:
|
||
| Hypotheses regarding proportion defective |
The corresponding hypotheses that can be tested are:
|
||
| Test statistic based on a normal approximation |
Given a random sample of measurements
Y1, ..., YN
from a population, the proportion of items that are judged
defective from these N measurements is denoted
depends on a normal approximation to the binomial distribution that is valid for large N, (N > 30). This approximation simplifies the calculations using critical values from the table of the normal distribution as shown below. |
||
| Restriction on sample size |
Because the test is approximate, N needs to be large for
the test to be valid. One criterion is that N should be
chosen so that
For example, if p0
= 0.1, then N should be at least 50 and if
p0
= 0.01, then N should be at least 500.
Criteria for choosing a sample size in
order to guarantee detecting a change of size
|
||
| One and two-sided tests for proportion defective |
Tests at the
1 -
|
||
| Example of a one-sided test for proportion defective |
After a new method of processing wafers was introduced into a
fabrication process, two hundred wafers were tested, and
twenty-six showed some type of defect. Thus, for N= 200,
the proportion defective is estimated to be
|
||
| Calculations for a one-sided test of proportion defective |
For a test at significance level
|
||
| Interpretation | Because the test statistic is less than the critical value (1.645), we cannot reject hypothesis (3) and, therefore, we cannot conclude that the new fabrication method is degrading the quality of the wafers. The new process may, indeed, be worse, but more evidence would be needed to reach that conclusion at the 95% confidence level. | ||